Introduction

This guide will present easy, step by step instructions on how to remove the front side of the IBM WorkPad c3 case. This case is glued together, so time will need to be spent heating the glue. This time varies, but you should expect to spend at least 10 minutes heating.

Pièces

Aucune pièce nécessaire.

Turn the device over so that the screen is facing down. In the next step the device will be heated, so the screen must be turned over to prevent heat damage to the LCD/Digitizer.
  • Turn the device over so that the screen is facing down.

  • In the next step the device will be heated, so the screen must be turned over to prevent heat damage to the LCD/Digitizer.

Ajouter un commentaire

Using a hair dryer, slowly heat the edges of the WorkPad.
  • Using a hair dryer, slowly heat the edges of the WorkPad.

  • Spend at least one minute heating each side of the device. This will melt the glue holding the case together, and allow it to be removed.

  • Be sure not to touch the device directly after heating as it will be extremely hot. Use a towel or oven mitt to grab it.

Ajouter un commentaire

Use a plastic opening tool to pry the back case from the WorkPad. If the rear cover is not coming off very easily, you probably need to reheat the case in order to sufficiently melt the glue.
  • Use a plastic opening tool to pry the back case from the WorkPad.

  • If the rear cover is not coming off very easily, you probably need to reheat the case in order to sufficiently melt the glue.

Ajouter un commentaire

Turn the device over, so that the screen is laying on a flat surface. Turn the device over, so that the screen is laying on a flat surface.
  • Turn the device over, so that the screen is laying on a flat surface.

Ajouter un commentaire

If the back case has already been removed, carefully place it on the WorkPad to protect the circuitry inside from the heat. Using the hair dryer, slowly heat the edges of the device. Spend at least 1 minute on each side, thoroughly heating the case. The LCD/Digitizer combo is very sensitive to heat, and can easily be ruined if it is directly exposed to the hair dryer. Verify that the screen is face down.
  • If the back case has already been removed, carefully place it on the WorkPad to protect the circuitry inside from the heat.

  • Using the hair dryer, slowly heat the edges of the device. Spend at least 1 minute on each side, thoroughly heating the case.

  • The LCD/Digitizer combo is very sensitive to heat, and can easily be ruined if it is directly exposed to the hair dryer. Verify that the screen is face down.

Ajouter un commentaire

The device will be extremely hot. Use a towel or oven mitt to grab it. Using the Plastic Opening Tools, take the front of the case off.
  • The device will be extremely hot. Use a towel or oven mitt to grab it.

  • Using the Plastic Opening Tools, take the front of the case off.

  • If the case is difficult to remove, try repeating step 2.

  • The power button at the top of the device will be loose once the front part of the case is removed.

Ajouter un commentaire

Conclusion

To reassemble your device, follow these instructions in reverse order.

Emily Falkenstein

Membre depuis le 05/10/2010

51 Réputation

5 tutoriels rédigés

Équipe

Cal Poly, Team 21-35, Regan Fall 2010 Membre de l'équipe Cal Poly, Team 21-35, Regan Fall 2010

CPSU-REGAN-F10S21G35

3 membres

5 tutoriels rédigés

Ajouter un commentaire

Voir les statistiques:

Dernières 24 heures : 0

7 derniers jours : 0

30 derniers jours : 1

Total : 2,263