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Contribution d'origine par : Abrsvc

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I will echo the recommendation to apply new thermal compound after removing  the old.  I will add however, that it is critical that you do NOT have any air bubbles in it.  Air is a very good insulator and you don't want insulation here.  You want good heat conduction to the heat sink.  A little too much compound is better than not enough.  Just don't go overboard with the  amount.  Spread a thin layer without any bubbles across the entire CPU surface.  If it spills over the side, again don't go crazy, but it won't be a problem.  This compound is a heat conductor not a conductor of electricity.

Dan

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