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Contribution d'origine par : Minho ,

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It’s a pretty risky approach to just reball the NAND without really understanding what’s wrong with the device. You could damage the chip or the logic board during the process, to the point where it becomes difficult to retrieve data.

When dealing with a dead device, spend some time to do at least some rudimentary probing. Check the main power lines and the main PMIC outputs (PPCPU/GPU, SOC, FIXED, SDRAM, NAND etc). If that looks good, then check the main BBPMU outputs.

Because the phone was crushed, it may just end up being a few bad solder balls somewhere but before applying tons of heat, try to rule out the easy stuff, like subsystem shorts.

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