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Introduction

REWA LAB received an iPhone X that had been severely damaged in a car accident. Today we will show you how to restore it step by step. Let's bring it back to life!

Vidéo d'introduction

  1. The phone has been severely damaged. The screen is shattered and the back glass is broken,  the midframe is also deformed.
    • The phone has been severely damaged. The screen is shattered and the back glass is broken, the midframe is also deformed.

    • Let’s remove the display assembly. The Face ID parts and the rear camera look just fine. The motherboard also looks fine too. However, The battery is severely deformed.

  2. Get a new display assembly installed. And then connect the battery connector with the DC Power Supply. The phone turns on normally, but the touch screen is unresponsive. We can see there is an obvious gap between the third space PCB and the lower layer. And the lower layer is badly deformed.
    • Get a new display assembly installed. And then connect the battery connector with the DC Power Supply. The phone turns on normally, but the touch screen is unresponsive.

    • We can see there is an obvious gap between the third space PCB and the lower layer. And the lower layer is badly deformed.

    • We need to swap the lower layer.

  3. Place the motherboard on the heating platform. Heat for several minutes and then remove the upper layer.
    • Place the motherboard on the heating platform. Heat for several minutes and then remove the upper layer.

    • Remove thermal compound covering CPU. Clean bonding pads around the edge with Solder Wick.

  4. We can see that several pads have come off the board. Among these missing pads, S7, S8 S11 and S12 are important signal pins. We need to treat them by jumping wires.
    • We can see that several pads have come off the board. Among these missing pads, S7, S8 S11 and S12 are important signal pins. We need to treat them by jumping wires.

    • The rests are ground pins and test pins. We can just leave them alone.

    • Apply paste flux to the four missing signal pins. Heat with the pointed-tip Soldering Iron. And solder 0.02mm Enameled Copper Wire to the four missing pads respectively. Once done, cut off the excess wire with Sculpture Knife. Then loop the wire around the missing pad.

    • Apply some UV Curable Solder Mask afterwards.

    • Remember to scrape off excess UV Curable Solder Mask. Make sure the soldered wire is exposed.

  5. Attach a known good lower layer to the test fixture and then attach the upper layer.
    • Attach a known good lower layer to the test fixture and then attach the upper layer.

    • Get the display assembly connected. Connect the battery connector with the DC Power Supply. Get the motherboard powered on with tweezers. The phone turns on normally. The touch function is also normal.

    • Judging by this, the touch issue is caused by the lower layer.

  6. Since the lower layer is badly deformed, we need to transplant baseband CPU, baseband EEPROM and the NFC chip on the original lower layer to a new lower layer. Detach baseband CPU, baseband EEPROM and the NFC chip from the new lower layer. Clean the three bonding pads afterwards. Heat with Hot Air Gun to remove baseband CPU, baseband EEPROM and the NFC chip of the original lower layer. Then get the three chips reballed.
    • Since the lower layer is badly deformed, we need to transplant baseband CPU, baseband EEPROM and the NFC chip on the original lower layer to a new lower layer.

    • Detach baseband CPU, baseband EEPROM and the NFC chip from the new lower layer. Clean the three bonding pads afterwards.

    • Heat with Hot Air Gun to remove baseband CPU, baseband EEPROM and the NFC chip of the original lower layer. Then get the three chips reballed.

    • Solder the reballing-finished NFC chip, baseband EEPROM and baseband CPU to the new lower layer.

  7. Attach the original upper layer and the new lower layer to the Test Fixture.
    • Attach the original upper layer and the new lower layer to the Test Fixture.

    • Get the display assembly connected. Connect the battery connector with the DC Power Supply. Get the motherboard powered on with tweezers.

    • Go to Settings>General>About. Here we can find IMEI serial number and modem firmware. Which indicates that the lower layer swap has been completed successfully.

  8. Next thing we do is to solder the two layers together. Get the new lower layer reballed first. In this step we will need two tools, the specialized reballing mold and the heating platform.
    • Next thing we do is to solder the two layers together.

    • Get the new lower layer reballed first. In this step we will need two tools, the specialized reballing mold and the heating platform.

    • Once done, apply BGA Paste Flux to the third space PCB. Get the upper layer in position. Heat for 1 minute on the heating platform.

  9. Get a new back glass assembly. Get the original Face ID parts and rear camera installed . Then get the motherboard installed and flex cables connected.
    • Get a new back glass assembly. Get the original Face ID parts and rear camera installed . Then get the motherboard installed and flex cables connected.

    • Get a new battery installed. Then get the original earpiece speaker and sensor assembly installed onto the new screen.

  10. Connect the original screen with the display extended module. Read data of the original screen with the True Tone repair programmer.
    • Connect the original screen with the display extended module. Read data of the original screen with the True Tone repair programmer.

    • Once done, connect the new screen with the display extended module. Write stored data of the original screen to the new screen.

  11. Get the new screen connected. Press the power button to turn on the phone. Run function test. All going well. However, the WiFi switch cannot be toggled.
    • Get the new screen connected. Press the power button to turn on the phone. Run function test. All going well. However, the WiFi switch cannot be toggled.

  12. We need to unbind WiFi. Connect iRepair DFU Box to the computer. Then connect the phone with iRepair DFU Box. Put the phone into DFU mode. Open the software. Click ‘DFU Model’. Then click ‘Query Info’. Click ‘Unlock WiFi’ to have the WiFi unbound.
    • We need to unbind WiFi.

    • Connect iRepair DFU Box to the computer. Then connect the phone with iRepair DFU Box. Put the phone into DFU mode.

    • Open the software. Click ‘DFU Model’. Then click ‘Query Info’. Click ‘Unlock WiFi’ to have the WiFi unbound.

    • Disconnect the phone. The phone turns on automatically. The WiFi switch is back to normal. iPhone X restoration has been completed successfully.

Une autre personne a terminé cette réparation.

Phryne

Membre depuis le 17/11/2019

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