Introduction
daughterboard cover prereq only
Ce dont vous avez besoin
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Before you begin, switch off your phone.
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Apply a heated iOpener to the back of the phone to loosen the adhesive beneath the back cover. Apply the iOpener for at least two minutes.
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Secure a suction handle to the bottom of the back cover, as close to the edge as possible.
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Lift the back cover with the suction handle to create a small gap between the cover and the frame.
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Insert an opening pick into the gap.
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If you have trouble, apply more heat to further soften the adhesive. Follow the iOpener instructions to avoid overheating.
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Slide the opening pick to the bottom right corner.
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If the adhesive becomes hard to cut it most likely cooled down. Use your iOpener to reheat it.
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Insert a fourth opening pick under the top left corner of the back cover.
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Slide the opening pick along the top edge of the phone to cut the adhesive.
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Leave the opening pick in the top right corner to prevent the adhesive from resealing.
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Use a pair of tweezers to peel the black tape next to the rear camera off the motherboard cover.
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To reassemble your device, follow these instructions in reverse order.
To reassemble your device, follow these instructions in reverse order.
