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Modifications apportées à l'étape #12

Modifié par Andrew Bookholt

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Lignes de l'étape

[* black] If necessary, use a spudger to pry up the left edge of the logic board to separate the solidified thermal paste from the heat sink.
[* icon_note] If any resistance is felt when prying up on the logic board, we recommend softening the thermal paste by heating the board with a blowhair dryer or a heat gun before prying further.
[* icon_note] If any resistance is felt when prying up on the logic board, we recommend softening the thermal paste by heating the board with a blowhair dryer or a heat gun before prying further.