Modifications apportées à l'étape #9
Modifié par Walter Galan —
Modification approuvée par Walter Galan
- Avant
- Après
- Inchangé
Lignes de l'étape
| - | [* black] We have finally reached the motherboard, well sort of. The motherboard is covered in copper shielding. |
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| - | [* black] Copper shielding: good for heat dissipation and electrical grounding, bad for repairability. |
| [* black] The motherboard of the HTC One is pretty much encapsulated within a copper shielding. Two flat pieces of copper adorn each side of the motherboard. | |
| + | [* black] Here's the thing about copper shielding. It dissipates heat and provides electrical grounding. However, copper shielding is a pain to deal with during reassembly. |