Modifications apportées à l'étape #9
Modifié par Miroslav Djuric —
Modification approuvée par Miroslav Djuric
- Avant
- Après
- Inchangé
Lignes de l'étape
| - | [* black] The motherboard of the HTC One is pretty much encapsulated within |
|---|---|
| - | [* black] Here's the thing about copper shielding. It dissipates heat and provides electrical grounding. However, copper shielding is a pain to deal with during reassembly. |
| + | [* black] The motherboard of the HTC One is pretty much encapsulated within copper shielding. Two flat pieces of copper adorn each side of the motherboard. |
| + | [* black] Here's the thing about copper shielding. It dissipates heat and provides electrical grounding. However, copper shielding is a pain to deal with during reassembly—kind of like trying to straighten out aluminum foil once it's been crinkled. |