Modifications apportées à l'étape #10
Modifié par David Hodson —
Modification approuvée par David Hodson
- Avant
- Après
- Inchangé
Lignes de l'étape
[* black] All ICs are located on the front side of the motherboard: | |
- | [* red] Elpida BA164B1PF 2 GB DDR2 RAM + Qualcomm Snapdragon 600 |
- | [* yellow] Samsung [link|http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf|KLMBG4GE2A|new_window=true] 32 GB NAND |
- | [* orange] Qualcomm [http://www.ubmtechinsights.com/reports-and-subscriptions/open-market-reports/Report-Profile/?ReportKey=8543|PM8921|new_window=true] |
+ | [* red] Elpida BA164B1PF 2 GB DDR2 RAM + Qualcomm Snapdragon 600 quad-core 1.7 GHz CPU |
+ | [* yellow] Samsung [link|http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf|KLMBG4GE2A|new_window=true] 32 GB NAND flash memory |
+ | [* orange] Qualcomm [http://www.ubmtechinsights.com/reports-and-subscriptions/open-market-reports/Report-Profile/?ReportKey=8543|PM8921|new_window=true] power management IC |
[* green] Qualcomm [http://www.qualcomm.com/chipsets/gobi|MDM9215M|new_window=true] 4G GSM/UMTS/LTE modem | |
[* blue] Synaptics S32028 | |
- | [* violet] TriQuint [link|http://www.triquint.com/products/p/TQM7M9023|TQM7M9023|new_window=true] |
- | [* black] Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4335|BCM4335|new_window=true] |
+ | [* violet] TriQuint [link|http://www.triquint.com/products/p/TQM7M9023|TQM7M9023|new_window=true] multi-band power amplifier |
+ | [* black] Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4335|BCM4335|new_window=true] single-chip 5G WiFi™ 802.11ac MAC/baseband/radio with Bluetooth 4.0+HS & FM receiver |