Modifications apportées à l'étape #10
Modifié par Manish K —
Modification approuvée par David Hodson
- Avant
- Après
- Inchangé
Lignes de l'étape
| [* black] All ICs are located on the front side of the motherboard: | |
| [* red] Elpida BA164B1PF 2 GB DDR2 RAM + Qualcomm Snapdragon 600 quad-core 1.7 GHz CPU | |
| - | [* |
| - | [* |
| + | [* orange] Samsung [link|http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf|KLMBG4GE2A|new_window=true] 32 GB NAND flash memory |
| + | [* yellow] Qualcomm [http://www.ubmtechinsights.com/reports-and-subscriptions/open-market-reports/Report-Profile/?ReportKey=8543|PM8921|new_window=true] power management IC |
| [* green] Qualcomm [http://www.qualcomm.com/chipsets/gobi|MDM9215M|new_window=true] 4G GSM/UMTS/LTE modem | |
| [* blue] Synaptics S32028 | |
| [* violet] TriQuint [link|http://www.triquint.com/products/p/TQM7M9023|TQM7M9023|new_window=true] multi-band power amplifier | |
| [* black] Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4335|BCM4335|new_window=true] single-chip 5G WiFi™ 802.11ac MAC/baseband/radio with Bluetooth 4.0+HS & FM receiver |