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Modifications apportées à l'étape #3

Modifié par bushing

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Lignes de l'étape

[* black] While pushing onFlip the card slots and the headphone jack, use the plastic opening toolunit over.
[* black] Use a spudger
to carefully separatepry open the back panel fromgap between the rest ofbottom case and the device
[* icon_caution] Be careful of
front panel. Work all the wires that are onway around the inside ofcase until the devicepanel is free.
[* icon_note] The rightblue] Avoid touching the L and left bumpers tendR shoulder buttons, because they pop off easily and are difficult to fall out when the cover is removed. You can prevent this by turning the device over before removingreassemble. Keeping the coverbottom case against your workbench will help hold them in place.
[* black] While pushing onFlip the card slots and the headphone jack, use the plastic opening toolunit over.
[* black] Use a spudger
to carefully separatepry open the back panel fromgap between the rest ofbottom case and the device
[* icon_caution] Be careful of
front panel. Work all the wires that are onway around the inside ofcase until the devicepanel is free.
[* icon_note] The rightblue] Avoid touching the L and left bumpers tendR shoulder buttons, because they pop off easily and are difficult to fall out when the cover is removed. You can prevent this by turning the device over before removingreassemble. Keeping the coverbottom case against your workbench will help hold them in place.

Image 1

Ancienne version

Nouvelle version

Image 2

Ancienne version

Nouvelle version

Image 3

Supprimé