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Pièces & Outils

Modifications apportées à l'étape #15

Modifié par Lauren Murphy

Modification approuvée par Adam O'Camb

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Lignes de l'étape

[* black] 'The south bridge is located in the red square in the picture.
[* black] The chipset is located in the blue square in the picture. The chipset combines the north bridge and the Intel GMA 950 into one die.
[* black] The heat sink uses thermal paste and pads.
[* black] The thermal pad inis located in the green square in the picture.
[* black] The thermal pad inis located in the green square in the picture.
[* black] The thermal paste is located in the red square in the picture.