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Modifications apportées à l'étape #13

Modifié par Jeff Suovanen

Modification approuvée par Jeff Suovanen

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-[* black] Advanced mobo shots for ID, this step will get reordered when we're closer to done with the teardown. I have some detail shots if you need them
+[* black] Samsung [https://memorylink.samsung.com/ecomobile/mem/ecomobile/product/productDetail.do?topMenu=P&subMenu=mobileDram&partNo=K3QF7F70DM-QGCF&partSetNo=LPDDR3&partSetLabel=LPDDR3|K3QF7F70DM-QGCF|new_window=true] 3 GB LPDDR3 RAM
+[* black] Toshiba [http://www.toshiba-components.com/memory/data/Toshiba_%20eMMC_final.pdf|THGBMBG9D8KBAIG|new_window=true] eMMC 5.0 64 GB storage
+[* black] Qualcomm [https://chipworks.secure.force.com/catalog/ProductDetails?sku=QUA-WTR1625L&viewState=DetailView&cartID=&g=|WTR1625L|new_window=true] RF Transceiver
+[* black] Skyworks [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SKY-SKY77629-21&viewState=DetailView&cartID=&g=|SKY77629-21|new_window=true] Power Amplifier Module
+[* black] Qualcomm [http://www.chipworks.com/en/technical-competitive-analysis/resources/blog/the-wifi-battles-continueand-here-comes-qualcomm/|WCN3680|new_window=true] 802.11ac/FM/BT 4.0 combo chip