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Modifications apportées à l'étape #7

Modifié par Miroslav Djuric

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[* black] Shown here is a picture of the SiTime SI8002AC package with its outer protective casing removed.
-[* black] An ASIC to convert the raw signals of the oscillator is stacked on top of the oscillator itself, and the two are wire-bonded together for signal transfer. This entire unit is completely sealed inside the plastic outer package.
-[* black] The second picture is an X-Ray of a Bosch BMA 220 showing its stacked die configuration and the wire bonds connecting those dies both together and to the ball grid array.
- [* black] Stacking dies allows chip manufacturers to pack more functionality on the same basic footprint. This is especially important in mobile devices such as the iPhone 4 where board space is at a minimum.
+[* black] An ASIC - which converts the raw signals of the oscillator - is stacked on top of the oscillator itself, and the two are wire-bonded together for signal transfer. This entire unit is completely sealed inside the plastic outer package.
+[* black] The second picture is an X-Ray of a stacked die configuration of a Bosch BMA 220. The wire bonds connect the dies both together and to the ball grid array.
+ [* black] Stacking dies allows chip manufacturers to pack more functionality on the same footprint. This is especially important in mobile devices such as the iPhone 4, where board space is minimal.