Modifications apportées à l'étape #4
Modifié par Marcelo Santos III —
Modification approuvée par Walter Galan
- Avant
- Après
- Inchangé
Lignes de l'étape
| [* black] Having popped the top off, we get a look at the entire interior. Look at all this modular hardware! | |
| [* black] The large interconnect cable even has friendly labeled ends: the side labeled ''IO'' connects to the ''Input/Output'' board, while the side labeled ''MB'' connects to ''[https://en.wikipedia.org/wiki/Canadian_postal_abbreviations_for_provinces_and_territories|Manitoba, Canada|new_window=true].'' Or maybe the motherboard... | |
| [* black] The I/O board also hosts the power jack, a common point of failure. It looks like fixing a broken power jack will be as easy as replacing this little board. A+ | |
| - | [* icon_caution] Upon removing a hefty bracket, we're a bit surprised to find it's actually a heat sink. Shunting heat straight into the battery seems an odd design choice; [http://batteryuniversity.com/learn/article/how_heat_and_harsh_loading_reduces_battery_life|batteries don't much |
| + | [* icon_caution] Upon removing a hefty bracket, we're a bit surprised to find it's actually a heat sink. Shunting heat straight into the battery seems an odd design choice; [http://batteryuniversity.com/learn/article/how_heat_and_harsh_loading_reduces_battery_life|batteries don't like too much heat|new_window=true]. |
| [* icon_note] That said, it's the same [guide|51568|passive cooling strategy employed by the massively popular Surface Pro 4|stepid=112628]. |