Modifications apportées à cette étape
Modifié par Mathew Fuller —
- Avant
- Après
- Inchangé
Lignes de l'étape
[* black] Now the top casing has been removed and isolated from the rest of the device. |
[* black] From here, you can make repairs to the top casing. |
[* black] Note: Once the top panel is removed the main board will still be attached to the bottom panel. |