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Modifications apportées à l'étape #12

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[* black] Flipping both boards over reveals a lot of nothing on the smaller board, but a ton of chips on the motherboard—a "smörgås-board," if you will:
[* red] RFMD [http://http://www.rfmd.com/CS/Documents/SL_Eurasia%20RF6260_0109.pdf|RF6260http://www.rfmd.com/CS/Documents/SL_Eurasia%20RF6260_0109.pdf|RF6260] Quad-band Multimode Power Amplifier Module
[* red] RFMD [http://http://www.rfmd.com/CS/Documents/SL_Eurasia%20RF6260_0109.pdf|RF6260http://www.rfmd.com/CS/Documents/SL_Eurasia%20RF6260_0109.pdf|RF6260] Quad-band Multimode Power Amplifier Module
[* orange] Samsung KMVYL000LM Multichip Memory Package, which we believe to house 512 MB of RAM in addition to the main processor.
[* yellow] Samsung [https://chipworks.secure.force.com/catalog/ProductDetails?sku=SAM-K3PE7E700M-XGC1&viewState=DetailView&cartID=&g=&parentCategory=&navigationStr=CatalogSearchInc&searchText=circuit|K3PE7E700M] 512 MB DDR2 SDRAM
[* green] Samsung [http://www.abiresearch.com/research/1008688-Samsung%3A+SWB-B42+-+BCM4330+module+BT+4.0+dual+band+Wlan+FM+RxTx|SWB-B42] BT 4.0 Dual Band Wlan FM Tx/Rx. [http://www.chipworks.com/index.php|Chipworks] says the module is actually manufactured by Murata, and houses a Broadcom BCM4330 die inside.
[* blue] NXP [https://chipworks.secure.force.com/catalog/ProductDetails?sku=NXP-65N00|65N00] Smart Card IC. According to Chipworks, this two-die package houses an MCU and a PN544 NFC controller.
[* violet] Silicon Image [http://www.siliconimage.com/products/product.aspx?pid=169|9244] MHL transmitter