Historique de l'étape n° 20 de iPad 3 4G Teardown

Modifications apportées à l'étape #20

Modifié par tom — 18 mars 2012

	[* black] So here's a bonus for all of you: the A5X cover removed.
	[* black] Underneath the cover we find the A5X processor flip chip mounted onto the carrier PWB.
	[* black] It's a safe bet that the A5X cover is a heat sink for the CPU, given there's thermal paste underneath and a thermal pad on top of the cover.
-	[* ~~black~~] The A5X [http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns/2012/03/the-new-ipad-a-closer-look-inside/\|measures] 12.82 mm x 12.71 mm (162 mm^2) which is 36% larger than the A5.
+	[* icon_note] The A5X [http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns/2012/03/the-new-ipad-a-closer-look-inside/\|measures] 12.82 mm x 12.71 mm (162 mm^2) which is 36% larger than the A5.