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Introduction

iPhone water damage is a very common repair case, and it can result in different issues. For case today, iPhone 6 can't turn on after water damage. We start the repair work from moldy components. As it is often suggested that we should always begin with simple, then complex. However, the problem remains unresolved. Run further measurement and the faulty position is finally confirmed. We can complete the iPhone 6 water damage repair work by replacing faulty components.

Vidéo d'introduction

  1. Check the logic board. We can see clearly that the water damage indicator is red. Get  the phone powered on. The phone turns on with Apple logo. Yet the screen goes black after 15 seconds and cannot access the system normally.
    • Check the logic board. We can see clearly that the water damage indicator is red.

    • Get the phone powered on. The phone turns on with Apple logo. Yet the screen goes black after 15 seconds and cannot access the system normally.

    • Boot current reading on the ammeter jumps to 510mA and then stays still.

  2. First thing we do is to clean the logic board with PCB Cleaner. Then get the board powered on. Current reading on the ammeter jumps to 220mA and then stays still.
    • First thing we do is to clean the logic board with PCB Cleaner.

    • Then get the board powered on. Current reading on the ammeter jumps to 220mA and then stays still.

  3. We need to detach mouldy ICs on the board and run thorough cleaning.
    • We need to detach mouldy ICs on the board and run thorough cleaning.

    • We can see clearly that U1501 and U1503 bear obvious mouldy signs. Remove the two ICs and then clean their bonding pads.

  4. Continue to detach the two mouldy components, U2402 and U0900 from the board. We can see clearly that area under U2402 has got seriously mildewed. This might be the cause.
    • Continue to detach the two mouldy components, U2402 and U0900 from the board. We can see clearly that area under U2402 has got seriously mildewed.

    • This might be the cause.

  5. Clean these bonding pads carefully. Solder new ICs to the board. Solder new ICs to the board.
    • Clean these bonding pads carefully.

    • Solder new ICs to the board.

  6. Now we can assemble the phone and test.
    • Now we can assemble the phone and test.

    • Press power button to power on. The phone turns on normally.

2 autre(s) ont terminé cette réparation.

Phryne

Membre depuis le 17/11/2019

10 421 Réputation

80 tutoriels rédigés

fabulous video

kumar saurabh - Réponse

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