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Traduction de l’étape 3

Étape 3
A member of the Chipworks development team sets up parameters on Ibe for the removal of the dielectrics on an advanced node chip (like the A6) where there may be up to 9 copper layers and 1 aluminum layer, as well as polysilicon and substrate layers. Recently, Chipworks completed an addition to their de-layering lab, adding several more wet benches, fume hoods, and polishing stations. Recently, Chipworks completed an addition to their de-layering lab, adding several more wet benches, fume hoods, and polishing stations.
  • A member of the Chipworks development team sets up parameters on Ibe for the removal of the dielectrics on an advanced node chip (like the A6) where there may be up to 9 copper layers and 1 aluminum layer, as well as polysilicon and substrate layers.

  • Recently, Chipworks completed an addition to their de-layering lab, adding several more wet benches, fume hoods, and polishing stations.

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