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Traduction de l’étape 9

Étape 9
After that brief board break, we continue our journey into the headset. Now tethered by just two headphone interconnect cables, the headset is easily lifted away and set aside. Where the original Vive kept nearly all its onboard silicon clustered onto a single board, the sequel uses two smaller boards. This daughterboard services the displays, I/O, and one or two other things we'll show you in just a moment.
  • After that brief board break, we continue our journey into the headset.

  • Now tethered by just two headphone interconnect cables, the headset is easily lifted away and set aside.

  • Where the original Vive kept nearly all its onboard silicon clustered onto a single board, the sequel uses two smaller boards. This daughterboard services the displays, I/O, and one or two other things we'll show you in just a moment.

  • While we are excited about the chips, we're a little bummed that the ports are still soldered to a board. Non-modular, high-stress components like ports can be a pricey repair.

  • This board also hosts the little linear potentiometer that formerly lived on its own FPC. That small slider tracks where you position the displays when making IPD adjustments.

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