Aller au contenu principal
Anglais
Français

Traduction de l’étape 9

Étape 9
All this glue has us tired—let's sit down for some chips: Micron MT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845
  • All this glue has us tired—let's sit down for some chips:

  • Micron MT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845

  • Skhynix H28S7Q302BMR 64 GB NAND flash (universal flash storage)

  • Google SR3HX Pixel Visual Core (as seen in the Pixel 2 XL)

  • Qualcomm SDR845 RF Transceiver

  • Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD)

  • Qualcomm QET4100 40MHz envelope tracker

  • Qualcomm PMI8998 PMIC

Toute cette colle nous a fatigués, asseyons-nous pour examiner quelques puces :

DRAM LPDDR4X de 4 Go Micron 8JE77G9WGH posée sur Qualcomm Snapdragon 845

Stockage flash Universal de 64 Go Skhynix H28S7Q302BMR

Pixel Visual Core Google SR3HX (également vu sur le Pixel 2 XL)

Émetteur-récepteur RF Qualcomm SDR845

Qualcomm QPM2622 et QPM2642

Dispositif de suivi d'enveloppe 40 MHz Qualcomm QET4100

IC de gestion d'alimentation Qualcomm PMI8998

[* black] All this glue has us tired—let's sit down for some chips:
[* red] Micron 8JE77G9WGHMT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845
[* orange] Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true] 64 GB UniversalNAND flash storage(universal flash storage)
[* red] Micron 8JE77G9WGHMT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845
[* orange] Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true] 64 GB UniversalNAND flash storage(universal flash storage)
[* yellow] Google [https://blog.google/products/pixel/pixel-visual-core-image-processing-and-machine-learning-pixel-2/|SR3HX|new_window=true] Pixel Visual Core (as seen in the [guide|98093|Pixel 2 XL|stepid=180076|new_window=true])
[* green] Qualcomm SDR845 RF Transceiver
[* light_blue] Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD)
[* light_blue] Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD)
[* blue] Qualcomm [https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100|new_window=true] 40MHz envelope tracker
[* violet] Qualcomm [http://www.eenewspower.com/news/adaptive-power-management-added-mobile-chipset|PMI8998|new_window=true] PMIC

Vos contributions sont faites dans le cadre de la licence open source Creative Commons.