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Traduction de l’étape 9

Étape 9
All this glue has us tired—let's sit down for some chips: Micron MT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845
  • All this glue has us tired—let's sit down for some chips:

  • Micron MT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845

  • Skhynix H28S7Q302BMR 64 GB NAND flash (universal flash storage)

  • Google SR3HX Pixel Visual Core (as seen in the Pixel 2 XL)

  • Qualcomm SDR845 RF Transceiver

  • Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD)

  • Qualcomm QET4100 40MHz envelope tracker

  • Qualcomm PMI8998 PMIC

Tutta questa colla ci ha stufato; ora sediamoci a guardare qualche chip:

4 GB di DRAM LPDDR4X Micron 8JE77G9WGH stratificata sopra al processore Qualcomm Snapdragon 845

64 GB di memoria Universal flash storage Skhynix H28S7Q302BMR

Pixel Visual Core Google SR3HX (già visto nel Pixel 2 XL)

Ricetrasmettitore RF Qualcomm SDR845

Qualcomm QPM2622 e QPM2642

Envelope tracker 40 MHz Qualcomm QET4100

PMIC Qualcomm PMI8998

[* black] All this glue has us tired—let's sit down for some chips:
- [* red] Micron 8JE77G9WGH 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845
- [* orange] Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true] 64 GB Universal flash storage
+ [* red] Micron MT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845
+ [* orange] Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true] 64 GB NAND flash (universal flash storage)
[* yellow] Google [https://blog.google/products/pixel/pixel-visual-core-image-processing-and-machine-learning-pixel-2/|SR3HX|new_window=true] Pixel Visual Core (as seen in the [guide|98093|Pixel 2 XL|stepid=180076|new_window=true])
[* green] Qualcomm SDR845 RF Transceiver
- [* light_blue] Qualcomm QPM2622 and QPM2642
+ [* light_blue] Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD)
[* blue] Qualcomm [https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100|new_window=true] 40MHz envelope tracker
[* violet] Qualcomm [http://www.eenewspower.com/news/adaptive-power-management-added-mobile-chipset|PMI8998|new_window=true] PMIC

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