Traduction de l’étape 7
Étape 7
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Digging out the motherboard we spy some serious shielding strategy—what treasures could these caps cover?
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Qualcomm SDM710 Snapdragon 710 processor
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Samsung KM2V7001CM 6 GB LPDDR4 memory and 128 GB storage package
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Skyworks SKY 78185-11 Low Band 2G/3G/4G Module
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Skyworks SKY 78187-11 High Band 2G/3G/4G Module
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SDR660 003 radio frequency IC
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Qualcomm PM670 & PM670A power management ICs
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Qualcomm WCN3990 WiFi 802.11ac, Bluetooth LE, and FM SoC
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