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Traduction de l’étape 5

Étape 5
On the flip side of the main PCB board is the micro-SD and the 3G SIM-socket. Use a soldering iron to remove the damaged socket. Using a lead-free solder will require more heat. You can use a traditional solder to decrease the temperature if necessary. (Add solder first, then remove with solder wick) SIM Socket is indicated by the green circle in the 1st image.
Remove damaged socket
  • On the flip side of the main PCB board is the micro-SD and the 3G SIM-socket. Use a soldering iron to remove the damaged socket. Using a lead-free solder will require more heat. You can use a traditional solder to decrease the temperature if necessary. (Add solder first, then remove with solder wick)

  • SIM Socket is indicated by the green circle in the 1st image.

  • Micro-SD Socket is indicated by the blue circle in the 1st image.

  • Since the old socket is damaged anyway, you do not need to remove it in one piece. Desolder each pad and carefully bend the holder upwards. Applying too much force could possibly damage one of the 8 pads on the PCB edge.

  • Clean the solder residue off of the 8 pads on the main PCB board.

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