Traduction de l’étape 5
Grind the MOSFET here with a grinding tool. Then heat with Hot Air Gun to take down the dot projector module. Continue heating with the Hot Air Gun. Clean residual parts of the MOSFET with tweezers.
Continue to apply some medium-temp solder paste to the bonding pad. Tin the bonding pad with Soldering Iron. Here we need 0.02mm Enameled Copper Wire. Heat with Soldering Iron. Connect Pin 2 and Pin 3 of the MOSFET with the wire.