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Traduction de l’étape 11

Étape 11
After learning the finer points of US vs. EU sandwicherie, let's tuck into the (mostly familiar) US silicon layers: Apple APL1W01 A14 Bionic SoC with Micron MT53D512M64D4UA-046 XT:F     4 GB LPDDR4 SDRAM layered over it (same as the iPhone 12/12 Pro)
  • After learning the finer points of US vs. EU sandwicherie, let's tuck into the (mostly familiar) US silicon layers:

  • Apple APL1W01 A14 Bionic SoC with Micron MT53D512M64D4UA-046 XT:F 4 GB LPDDR4 SDRAM layered over it (same as the iPhone 12/12 Pro)

  • 1UED, most likely a U1 ultra-wideband chip similar to the USI chip in other iPhones

  • STMicroelectronics STWPA1-3033ABM wireless charging IC, possibly something similar to their STWBC-EP chip

  • KIC M224 BE0408 TWNA 12031, 64 GB of Kioxia NAND flash memory

  • Qualcomm SDR865 5G and LTE transceiver

  • Qualcomm SDX55M 5G modem-RF system and SMR526 intermediate frequency IC

  • Apple APL1094 power management IC

Après notre apprentissage des subtilités de l'art du sandwich américain et européen, jetons un œil aux couches de silicium US (familières pour la plupart) :

Système sur une puce (SoC) A14 Bionic APL1W01 Apple, posé sur SDRAM LPDDR4 de 4 Go D9XMR Micron (la même que dans les iPhone 12/12 Pro)

1UED, très probablement une puce ultra-wideband U1 similaire aux puces USI d'autres iPhone

CI de charge sans fil STWPA1-3033ABM STMicroelectronics, peut-être quelque chose de similaire à leur puce STWBC-EP

KIC M224 BE0408 TWNA 12031, 64 Go de mémoire flash NAND Kioxia

Émetteur-récepteur LTE et 5G SDR865 Qualcomm

Système modem-RF 5G SDX55M et CI de fréquence intermédiaire SMR526 Qualcomm

CI de gestion d'alimentation APL1094 Apple

[* black] After learning the finer points of US vs. EU ''sandwicherie'', let's tuck into the (mostly familiar) US silicon layers:
- [* red] Apple APL1W01 A14 Bionic SoC, layered over Micron D9XMR 4 GB LPDDR4 SDRAM (same as the [guide|137669|iPhone 12/12 Pro|stepid=274767|new_window=true])
+ [* red] Apple APL1W01 A14 Bionic SoC with Micron MT53D512M64D4UA-046 XT:F 4 GB LPDDR4 SDRAM layered over it (same as the [guide|137669|iPhone 12/12 Pro|stepid=274767|new_window=true])
[* orange] [https://d3nevzfk7ii3be.cloudfront.net/igi/qJnyQq12VweloouY.full|1UED|new_window=true], most likely a [https://www.ifixit.com/News/33257/inside-the-tech-in-apples-ultra-wideband-u1-chip|U1|new_window=true] ultra-wideband chip similar to the USI chip in other iPhones
[* yellow] STMicroelectronics STWPA1-3033ABM wireless charging IC, possibly something similar to their [https://www.st.com/content/st_com/en/products/power-management/wireless-charger-ics/stwbc-ep.html#overview|STWBC-EP|new_window=true] chip
[* green] KIC M224 BE0408 TWNA 12031, 64 GB of [https://business.kioxia.com/en-us/memory/mlc-nand.html|Kioxia NAND flash|new_window=true] memory
[* light_blue] Qualcomm [https://www.techinsights.com/blog/analysis-qualcomms-snapdragon-sdr865-transceiver-supporting-5g-sub-6-ghz-and-lte-services|SDR865|new_window=true] 5G and LTE transceiver
[* blue] Qualcomm [https://www.qualcomm.com/products/snapdragon-x55-5g-modem|SDX55M|new_window=true] 5G modem-RF system and SMR526 intermediate frequency IC
[* violet] Apple APL1094 power management IC

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