Traduction de l’étape 4
Étape 4
Underside of the top-most layer
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Chip ID part 1:
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Apple APL1W10/339S01104 A16 64-bit hexa-core applications processor w/ penta-core GPU layered underneath most likely Samsung K3LK2K20CM-EGCP 6 GB LPDDR5 SDRAM memory
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Apple APL109A/338S00942 power management
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Apple/Dialog Semiconductor 338S00839-B0 power management
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Broadcom BCM59365EA1IUBG wireless power receiver
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STMicroelectronics STB601A05 power management
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Apple/Dialog Semiconductor 338S00819-A1 power management
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Texas Instruments TPS65657B0 display power supply
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