Aller au contenu principal

Changement ensemble carte mère et dissipateur thermique Xbox Series X

Info : Vous modifiez un tutoriel prérequis. Toutes les modifications apportées affecteront le tutoriel qui comprend ces étapes.

Anglais
Français

Traduction de l’étape 12

Étape 12
Xbox Series X Motherboard Removal (Motherboard): étape 0, image 1 de 2 Xbox Series X Motherboard Removal (Motherboard): étape 0, image 2 de 2
  • Roll the thermal putty into a ball.

  • Place the thermal putty where the damaged thermal pad was, making sure it's centered over the component—in this case a memory chip.

  • Optionally, you can use the flat end of a spudger (or an included applicator) to spread the thermal putty over the surface of the component.

  • When you reattach the heat sink, you'll compress the thermal putty and it'll spread the ball out.

Insérez ici votre traduction

Insérez ici votre traduction

Insérez ici votre traduction

Insérez ici votre traduction

+[* black] Roll the thermal putty into a ball.
+[* black] Place the thermal putty where the damaged thermal pad was, making sure it's centered over the component—in this case a memory chip.
+[* black] Optionally, you can use the flat end of a spudger (or an included applicator) to spread the thermal putty over the surface of the component.
+[* icon_note] When you reattach the heat sink, you'll compress the thermal putty and it'll spread the ball out.

Vos contributions sont faites dans le cadre de la licence open source Creative Commons.