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Traduction de l’étape 3

Étape 3
At this point, the logic board is held onto the heat sink by thermal compound. You may need to gently pry with a spudger to separate the logic board from the heat sink.
  • At this point, the logic board is held onto the heat sink by thermal compound.

  • You may need to gently pry with a spudger to separate the logic board from the heat sink.

  • Be very careful not to bend and break the logic board.

  • Remove the logic board from the heat sink.

En este punto, la placa lógica está sujeta al disipador de calor mediante un compuesto térmico.

Es posible que debas hacer palanca suavemente con un spudger para separar la placa lógica del disipador de calor.

Ten mucho cuidado de no doblar y romper la placa lógica.

Retira la placa lógica del disipador de calor.

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