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Traduction de l’étape 17

Étape 17
Here are two side X-rays of the A4 processor. The dark dots along the inside of the processor are solder balls connecting the dies together. These are known as Ball Grid Arrays (or BGAs) in the industry.
  • Here are two side X-rays of the A4 processor.

  • The dark dots along the inside of the processor are solder balls connecting the dies together. These are known as Ball Grid Arrays (or BGAs) in the industry.

  • These pictures are shot at two focal points across the width of the processor. They were quick shots, so we apologize if they're a little fuzzy.

  • The DRAM in the A4 is made by Samsung, so wirebonds are coming from both sides—unlike other DRAM modules Chipworks has seen from other manufacturers.

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