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Traduction de l’étape 22

Étape 22
In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place. As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case. The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.
  • In the next steps, you will use an iOpener to apply heat to the rear case of the iPad to soften adhesive holding the logic board in place.

  • As you reheat and place the iOpener in each of the indicated locations, leave it in place for at least a minute to soften the adhesive through the rear case.

  • The adhesive is in the form of six pieces of black foam tape—refer to this step as you work at heating and prying to keep track of where each piece is located.

Nei prossimi passi, userete un iOpener per applicare calore al case posteriore dell'iPad in modo tale da ammorbidire l'adesivo che mantiene la scheda logica in posizione.

Man mano che riscaldi e posizioni l'iOpener nelle posizioni indicate, lascialo in posizione per almeno un minuto in modo tale da ammorbidire l'adesivo attraverso il case posteriore.

L'adesivo è sottoforma di sei pezzi di nastro di schiuma nera: fai riferimento a questo passo quando riscaldi e fai leva per tenere traccia della posizione di ogni pezzo.

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