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Info : Vous modifiez un tutoriel prérequis. Toutes les modifications apportées affecteront les 25 tutoriels qui comprennent cette étape.

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Traduction de l’étape 4

Étape 4
Repeat the heating and cutting procedure for the remaining three sides of the phone. Leave an opening pick under each edge to prevent the adhesive from resealing. Leave an opening pick under each edge to prevent the adhesive from resealing.
  • Repeat the heating and cutting procedure for the remaining three sides of the phone.

  • Leave an opening pick under each edge to prevent the adhesive from resealing.

デバイスの残りの3辺においても同じ作業を繰り返してください。

接着剤が再装着しないように、各エッジに開口ピックを残しておきます。

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