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Traduction de l’étape 7

Étape 7
With that, it's time to digitally convey some chip ID. On the front side of the motherboard, we note:
  • With that, it's time to digitally convey some chip ID. On the front side of the motherboard, we note:

  • SK Hynix H9KNNNCTUMU-BRNMH 4 GB LPDDR4 SDRAM layered over the Qualcomm MSM8996 Snapdragon 820

  • Samsung KLUBG4G1CE 32 GB MLC Universal Flash Storage 2.0

  • Avago AFEM-9040 Multiband Multimode Module

  • Murata FAJ15 Front End Module

  • Qorvo QM78064 high band RF Fusion Module and QM63001A diversity receive module

  • Qualcomm WCD9335 Audio Codec

  • Maxim MAX77854 PMIC and MAX98506BEWV audio amplifier

Nachdem wir das Motherboard frisch rausgenommen haben, gucken wir doch mal, womit es belegt ist:

SK Hynix H9KNNNCTUMU-BRNMH 4 GB LPDDR4 SDRAM direkt auf dem Qualcomm MSM8996 Snapdragon 820

Samsung KLUBG4G1CE 32 GB MLC universeller Flashspeicher 2.0

Avago AFEM-9040 Multiband Multimode Modul

Murata FAJ15 Front End Modul

Qorvo QM78064 Highband RF Fusion Modul und QM63001A Diversity Empfangsmodul

Qualcomm WCD9335 Audio Codec

Maxim MAX77854 PMIC und MAX98506BEWV Audioverstärker

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