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Traduction de l’étape 7

Étape 7
With that, it's time to digitally convey some chip ID. On the front side of the motherboard, we note:
  • With that, it's time to digitally convey some chip ID. On the front side of the motherboard, we note:

  • SK Hynix H9KNNNCTUMU-BRNMH 4 GB LPDDR4 SDRAM layered over the Qualcomm MSM8996 Snapdragon 820

  • Samsung KLUBG4G1CE-B0B1 32 GB MLC Universal Flash Storage 2.0

  • Avago AFEM-9040 Multiband Multimode Module

  • Murata FAJ15 Front End Module

  • Qorvo QM78064 high band RF Fusion Module and QM63001A diversity receive module

  • Qualcomm WCD9335 Audio Codec

  • Maxim MAX77854 PMIC and MAX98506BEWV audio amplifier

Nachdem wir das Motherboard frisch rausgenommen haben, gucken wir doch mal, womit es belegt ist:

SK Hynix H9KNNNCTUMU-BRNMH 4 GB LPDDR4 SDRAM direkt auf dem Qualcomm MSM8996 Snapdragon 820

Samsung KLUBG4G1CE 32 GB MLC universeller Flashspeicher 2.0

Avago AFEM-9040 Multiband Multimode Modul

Murata FAJ15 Front End Modul

Qorvo QM78064 Highband RF Fusion Modul und QM63001A Diversity Empfangsmodul

Qualcomm WCD9335 Audio Codec

Maxim MAX77854 PMIC und MAX98506BEWV Audioverstärker

[* black] With that, it's time to digitally convey some chip ID. On the front side of the motherboard, we note:
[* red] SK Hynix [https://www.skhynix.com/static/filedata/fileDownload.do?seq=280|H9KNNNCTUMU-BRNMH|new_window=true] 4 GB LPDDR4 SDRAM layered over the Qualcomm [https://www.qualcomm.com/products/snapdragon/processors/820|MSM8996|new_window=true] Snapdragon 820
- [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/ufs/KLUBG4G1CE-B0B1?ia=2413|KLUBG4G1CE|new_window=true] 32 GB MLC Universal Flash Storage 2.0
+ [* orange] Samsung [http://www.samsung.com/semiconductor/products/flash-storage/ufs/KLUBG4G1CE-B0B1?ia=2413|KLUBG4G1CE-B0B1|new_window=true] 32 GB MLC Universal Flash Storage 2.0
[* yellow] Avago AFEM-9040 Multiband Multimode Module
[* green] Murata FAJ15 Front End Module
[* light_blue] Qorvo [http://www.qorvo.com/news/2016/qorvo-recognized-with-prestigious-global-td-lte-initiative-award-for-rf-fusion|QM78064|new_window=true] high band RF Fusion Module and [http://www.qorvo.com/news/2016/qorvo-expands-support-of-highly-anticipated-marquee-smartphone-platform|QM63001A|new_window=true] diversity receive module
[* blue] Qualcomm WCD9335 Audio Codec
[* violet] Maxim MAX77854 PMIC and MAX98506BEWV audio amplifier

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