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Traduction de l’étape 11

Étape 11
We pop the pesky rear connector off the logic board, and are free to scan the silicon fields of glory! Apple A9 APL1022 SoC + SK Hynix  2 GB LPDDR4 RAM as denoted by the markings H9KNNNBTUMUMR-NLH Qualcomm MDM9625M LTE Modem (as seen in iPhone 6/6 Plus)
  • We pop the pesky rear connector off the logic board, and are free to scan the silicon fields of glory!

  • Apple A9 APL1022 SoC + SK Hynix 2 GB LPDDR4 RAM as denoted by the markings H9KNNNBTUMUMR-NLH

  • Qualcomm MDM9625M LTE Modem (as seen in iPhone 6/6 Plus)

  • Qualcomm WTR1625L RF Transceiver (as seen in iPhone 6/6 Plus)

  • Qualcomm QFE1100 Envelope Tracking IC (as seen in 6s/6s Plus, and 6/6 Plus)

  • Skyworks SKY77611 Quad-band Power Amplifier Module

  • We'd like to extend a huge thanks to our friends at Chipworks for helping us ID all of these chips! Check out their rad teardown of the iPhone SE for even more silicon goodness.

基板から強固に留められた背面コネクタを取り出します。すると栄光のシリコンの部分を全て確認ことができました!

Apple A9 APL1022 SoC + SK Hynix 2 GB LPDDR4 RAM (H9KNNNBTUMUMR-NLHという特記)

Qualcomm MDM9625MLTE Modem (iPhone 6/6 Plusと同じ)

Qualcomm WTR1625L RF Transceiver ( iPhone 6/6 Plusと同じ)

Qualcomm QFE1100Envelope Tracking IC (6s/6s Plusと同じ)

Skyworks SKY77611Quad-band Power Amplifier Module

これら全てのチップの認識に多大なる協力をしてくれた友人、Chipworks に特別な敬意を表したいと思います。 iPhone SEのシリコンについての分解はChipworks によるすごい分解もご覧ください。

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