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Étape 1
Safely remove components, such as digitiser and battery and disconnect all flex cables, which secure logic board inside the device. Correct tools and observation of all ESD precautions should be high priority due to sensitivity of the board. Multilayered high population logic board located within latest electronic devices are prone to flex damage, which causes cold solder joint appearance. Any kind of flexing or mishandling of the PCB should be avoided. Multilayered high population logic board located within latest electronic devices are prone to flex damage, which causes cold solder joint appearance. Any kind of flexing or mishandling of the PCB should be avoided.
Logic Board Disassembly
  • Safely remove components, such as digitiser and battery and disconnect all flex cables, which secure logic board inside the device. Correct tools and observation of all ESD precautions should be high priority due to sensitivity of the board.

  • Multilayered high population logic board located within latest electronic devices are prone to flex damage, which causes cold solder joint appearance. Any kind of flexing or mishandling of the PCB should be avoided.

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