Traduction de l’étape 11
Étape 11
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The front side of the motherboard contains the following major chips:
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Toshiba TC31501AAMBG WiMax package. According to Chipworks, "This device operates in the 2.5GHz frequency band and offers high-speed connectivity in the mobile environment with low power consumption." (Thanks guys!)
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Broadcom BCM4330XKFFBG 802.11 a/b/g/n MAC/Baseband/Radio with Integrated Bluetooth 4.0+HS and FM Transceiver/Receiver
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Maxim MAX8997 Power Management IC
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WIP4255H
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Avago CFI120 223713
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Maxim MAX8893C Power Management IC
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