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Smontaggio Nintendo Switch

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Traduction de l’étape 11

Étape 11
Nintendo Switch Teardown: étape 0, image 1 de 1

  • A small gathering of Miis ICs populates the front side of the motherboard:

  • NVIDIA ODNX02-A2 (presumably the Tegra X1-based SoC)

  • Samsung K4F6E304HB-MGCH 2 GB LPDDR4 DRAM (x2 for a total of 4 GB)

  • Broadcom/Cypress BCM4356 802.11ac 2×2 + Bluetooth 4.1 SoC

  • Maxim Integrated MAX77621AEWI+T three phase buck regulator (x2)

  • Rohm BM92T36 USB-C controller

  • Texas Instruments BQ24193 single cell battery charger (possibly)

  • Texas Instruments TMP451 remote/local temperature sensor

Una piccola folla di Miis circuiti integrati popola il lato frontale della scheda madre:

NVIDIA ODNX02-A2 (presumibilmente il SoC basato su Tegra X1)

2 DRAM LPDDR4 da 2 GB ciascuna Samsung K4F6E304HB-MGCH

SoC Broadcom/Cypress BCM4356 802.11ac 2×2 + Bluetooth 4.1

Regolatore di tensione Step-Down 3 fasi Maxim Integrated MAX77621AEWI+T (x2)

IC gestione alimentazione M92T36 630380

[* black] A small gathering of ~~Miis~~ ICs populates the front side of the motherboard:
[* red] NVIDIA ODNX02-A2 (presumably the Tegra X1-based SoC)
[* orange] Samsung [http://www.samsung.com/semiconductor/products/dram/mobile-dram/low-power-ddr4/K4F6E304HB-MGCH?ia=3107|K4F6E304HB-MGCH|new_window=true] 2 GB LPDDR4 DRAM (x2 for a total of 4 GB)
[* yellow] Broadcom/Cypress [https://www.broadcom.com/products/wireless/wireless-lan-bluetooth/bcm4356/|BCM4356|new_window=true] 802.11ac 2×2 + Bluetooth 4.1 SoC
[* green] Maxim Integrated [http://www.mouser.com/ProductDetail/Maxim-Integrated/MAX77621AEWI-T/?qs=wA9DIA%252b20CS%252bBd1U4kGWhQ==|MAX77621AEWI+T|new_window=true] three phase buck regulator (x2)
- [* light_blue] M92T36 630380 Power management IC
+ [* light_blue] Rohm BM92T36 USB-C controller
+ [* blue] Texas Instruments [link|https://www.ti.com/product/BQ24193|BQ24193] single cell battery charger (possibly)
+ [* violet] Texas Instruments [link|https://www.ti.com/product/TMP451|TMP451] remote/local temperature sensor

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