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Traduction de l’étape 11

Étape 11
We extract the I/O daughterboard. There's lots of ingress proofing in evidence here, including the speaker grille surround and the tiny seals on the USB Type-C connector and headphone jack—all part of that IP68 rating. The headphone jack itself remains a modular affair—good news for repairability, as this is a high-wear component. The headphone jack itself remains a modular affair—good news for repairability, as this is a high-wear component.
  • We extract the I/O daughterboard. There's lots of ingress proofing in evidence here, including the speaker grille surround and the tiny seals on the USB Type-C connector and headphone jack—all part of that IP68 rating.

  • The headphone jack itself remains a modular affair—good news for repairability, as this is a high-wear component.

Nous extrayons la carte fille E/S. Bon nombre de mesures pour l'étanchéité se mettent en évidence ici, comme la bordure de la grille du haut-parleur et les petits joints sur le connecteur USB type C et la prise jack – tous partie intégrante de l'indice IP68.

La prise jack reste modulaire – bonne nouvelle pour la réparabilité, puisque c'est un composant à forte usure.

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