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Traduction de l’étape 4

Étape 4
Slide the opening pick up both sides of the device in the small space between the midframe and the rear case to release the clips holding it in place. Note that the clips are not released by sliding through them, but rather the inward pressure the opening pick creates as it enters the gap around them. If the clasps fail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.
  • Slide the opening pick up both sides of the device in the small space between the midframe and the rear case to release the clips holding it in place.

  • Note that the clips are not released by sliding through them, but rather the inward pressure the opening pick creates as it enters the gap around them.

  • If the clasps fail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.

  • Do not attempt to remove the midframe yet! There is still a fragile ribbon cable underneath connecting the earpiece speaker to the motherboard.

Placez un outil d'ouverture dans l'encoche située en haut à gauche du téléphone.

Glissez l'outil d'ouverture le long de la jointure de l'appareil et soulevez le châssis central.

Entendre des clics lorsque vous soulevez le châssis central est normal parce que des crochets le maintiennent vers le bas.

Lorsque vous soulevez le châssis central, veillez à ne pas endommager la nappe reliant le haut-parleur interne à la carte mère.

[* red] Wedge an opening tool into the notch that is located at the top left part of the phone.
[*
black] Slide the opening tool across the seampick up both sides of the device in the small space between the midframe and lift the mid-frame.
[*
rear case to release the clips holding it in place.
[*
icon_note] Hearing clicksNote that the clips are not released by sliding ''through'' them, but rather the inward pressure the opening pick creates as you liftit enters the mid-frame off is normal because ofgap ''around'' them.
[* icon_note] If
the clasps holding it downfail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.
[* icon_caution] When lifting the mid-frame, be carefulDo not attempt to damageremove the midframe yet! There is still a fragile ribbon cable underneath connecting the earpiece speaker to the motherboard.
[* red] Wedge an opening tool into the notch that is located at the top left part of the phone.
[*
black] Slide the opening tool across the seampick up both sides of the device in the small space between the midframe and lift the mid-frame.
[*
rear case to release the clips holding it in place.
[*
icon_note] Hearing clicksNote that the clips are not released by sliding ''through'' them, but rather the inward pressure the opening pick creates as you liftit enters the mid-frame off is normal because ofgap ''around'' them.
[* icon_note] If
the clasps holding it downfail to come undone, try pushing the edge you're working on inward with your hand, or using a thicker tool like a spudger.
[* icon_caution] When lifting the mid-frame, be carefulDo not attempt to damageremove the midframe yet! There is still a fragile ribbon cable underneath connecting the earpiece speaker to the motherboard.

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