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Traduction de l’étape 2

Étape 2
Using a soldering iron set at 400 degrees Celsius (752 degrees Fahrenheit), heat the solder joints lateral to the headphone jack. Use a pair of tweezers to lift the headphone jack from the board.
  • Using a soldering iron set at 400 degrees Celsius (752 degrees Fahrenheit), heat the solder joints lateral to the headphone jack. Use a pair of tweezers to lift the headphone jack from the board.

  • Extreme caution should be taken when working with high-temperature equipment to reduce the chance of burns.

  • It is strongly recommended that this guide on desoldering surface-mounted components is referenced before proceeding.

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