Traduction de l’étape 17
Étape 17
-
The back of the logic board revealed:
-
Hynix H5TC2G83CFR DDR3L SDRAM 2Gbit 1600MHz chips
-
Hynix H5GQ2H24AFR - 2.5GHz 2Gbit GDDR5 memory chips
-
Texas Instruments Stellaris LM4FS1AH microcontroller with integrated ARM core
-
Renesas R4F2113 H8S series CISC MCU
-
Maxim MAX15119 Apple-specific IMVP7 CPU/GPU power controller
-
Cypress Semiconductor CY8C24794-24L - a Programmable SoC
Vos contributions sont faites dans le cadre de la licence open source Creative Commons.