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Traduction de l’étape 9

Étape 9
How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course. The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers. With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.
  • How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course.

  • The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers.

  • With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.

  • The iPhone X logic board is the first double-stacked board we've seen in an iPhone since the very first iPhone (third photo).

  • The downside of this clever design is that many board-level repairs will be a lot more difficult.

Comment Apple a pu comprimer encore plus de techniques sur 70 % de l'espace ? En pliant la carte en deux, bien sûr.

Les deux moitiés sont soudées ensemble. Nous avons donc eu besoin de l'aide de nos hôtes de Circuitwise et de leur station de soudage à air chaud BGA pour séparer les couches.

Une fois les pièces dessoudées, nous additionnons les différentes couches et obtenons 135 % de la taille de la carte mère de l'iPhone 8 Plus. C'est donc ça, faire plus avec moins, Apple ?

La carte mère de l'iPhone X est la première à double couche que nous trouvons dans un iPhone depuis le tout premier (troisième photo).

L'envers de la médaille de ce coup de génie en matière de design est que ce sera extrêmement difficile de réparer la carte mère, voire impossible dans certains cas.

[* black] How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course.
[* black] The two halves are soldered together, so we got some help from our hosts [https://www.circuitwise.com.au/|Circuitwise|new_window=true] and their BGA hot air rework station to separate the layers.
[* black] With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.
[* black] The iPhone X logic board is the first double-stacked board we've seen in an iPhone since the [guide|599|very first iPhone|stepid=3166|new_window=true] (third photo).
- [* icon_note] The downside of this clever design is that board-level repair will be extremely difficult—near impossible in some cases.
+ [* icon_note] The downside of this clever design is that many board-level repairs will be a lot more difficult.

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