Impressive stuff as usual iFixit.
Two observations however.
One is the second photo in step 13 showing the Broadcom IC's. some of the SMD capacitors and resistors are displaced from their correct placement, and is actually quite a mess.
The second observation is the photo in step 20, marked as the die of the A5 IC. I think this is actually the substrate that forms the ball grid array for soldering to the PCB, the IC is bonded out to this around the edges with traces leading to the regular pattern of dots. The dots are where the solder balls locate.
Lorsqu'il en aura reçu, il pourra afficher un graphique de sa réputation au fil du temps.
Voici un aperçu de ce à quoi ressemble ce graphique :
Aucun point de réputation obtenu pour l'instant.