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Traduction de l’étape 11

Étape 11
We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers. We immediately notice that this generation's logic board is more ... goopier ... than the board that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance. Finally, a beacon in the darkness—there's still a modular charging port!
  • We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers.

  • We immediately notice that this generation's logic board is more ... goopier ... than the board that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance.

  • Finally, a beacon in the darkness—there's still a modular charging port!

  • ... although if you tunnel this far into the case, there's a good chance you now have more broken parts than just the charging port.

  • Beneath that shiny liquid-resistant coating, we make out some chips:

  • Broadcom BCM59356A2KUBG wireless charging module

  • STMicroelectronics STM32L476MG 32-Bit ARM Cortex-M4 microcontroller w/ 1 Mb flash

  • TI 87A6FP

Nous commençons à voir une tendance ici. Pour sortir la couche suivante de ce boîtier, il faut, vous l'aurez deviné, plein de chaleur, un outil pour faire levier et une pince.

On s'aperçoit immédiatement que la carte logique de cette génération est plus .... visqueuse ... que la carte sortie de l'épave du premier fiasco d'AirPod - sans doute pour augmenter la résistance à l'eau.

Enfin, un rayon de lumière dans l'obscurité - il y a toujours un port de charge modulaire !

... bien que, si vous creusez aussi loin dans le boîtier, il y a de fortes chances que vous ayez maintenant plus de pièces cassées que juste le port de charge.

Sous cette couche brillante et résistante aux liquides, nous percevons quelques puces :

Module de charge sans fil Broadcom 59356A2KUBG

L476MGY6 A5

TI 87A6FP

[* black] We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers.
[* black] We immediately notice that this generation's logic board is more ... goopier ... than the [guide|75578|board|stepid=152781|new_window=true] that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance.
[* black] Finally, a beacon in the darkness—there's [guide|75578|still|stepid=152780|new_window=true] a modular charging port!
[* black] ... although if you tunnel this far into the case, there's a good chance you now have more broken parts than just the charging port.
[* black] Beneath that shiny liquid-resistant coating, we make out some chips:
- [* red] Broadcom 59356A2KUBG wireless charging module
- [* orange] L476MGY6 A5
+ [* red] Broadcom BCM59356A2KUBG wireless charging module
+ [* orange] STMicroelectronics [link|https://www.st.com/en/microcontrollers-microprocessors/stm32l476mg.html|STM32L476MG] 32-Bit ARM Cortex-M4 microcontroller w/ 1 Mb flash
[* yellow] TI 87A6FP

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