What thermal paste to use after bottom board swap?
Last night I did a bottom board swap on iPhone X (tried it for the first time and succeeded, very proud of myself :D). After I soldered both logic boards back together I have realised there is no thermal compound inside anymore. I want to do my repairs to the highest possible standards, so I think it's a good idea to apply some thermal paste back where it should be.
My question is what product do you use for it? What type of paste?
Cette question est-elle utile ?