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Sorti le 25 septembre 2015. Modèle A1687/A1634. La réparation de ce modèle est similaire à celle des versions précédentes et nécessite tournevis et outils pour faire levier. Disponible en GSM et CDMA / 16, 64 ou 128 Go / Argent, Or, Gris sidéral ou Or rosé.

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ran over and now bootloping

a customer brought in a 6s plus that was ran over by a car. they want to get it fixed to retrieve the data thats in the phone still. surprisingly the board dosent look bad and the housing wasnt even bent or anything. the issue im having is when i initially connect it to dc power it draws .01a for a second then goes to 0 and stays, until i prompt to boot. it turns on a shows the apple logo for about 3-5 seconds then cuts off again. (while it is on the boot current seems normal.) i havent tried to update or restore because i dont want to risk the data. so far all ive done is measure nand power rails and reball the nand to no avail. i also did a full visual inspection and cant find any cracked or visually damaged components. just posting to get some ideas

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It’s a pretty risky approach to just reball the NAND without really understanding what’s wrong with the device. You could damage the chip or the logic board during the process, to the point where it becomes difficult to retrieve data.

When dealing with a dead device, spend some time to do at least some rudimentary probing. Check the main power lines and the main PMIC outputs (PPCPU/GPU, SOC, FIXED, SDRAM, NAND etc). If that looks good, then check the main BBPMU outputs.

Because the phone was crushed, it may just end up being a few bad solder balls somewhere but before applying tons of heat, try to rule out the easy stuff, like subsystem shorts.

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i checked the main power rails and did probe around a bit before just reballing the nand. i did that because i saw a dent in the back of the phone near the nand and it was tuning on just not booting up. i got it working now so all is good. ty the the input though


just cba listing every point that i probed if i can even remember them all... lol


also how is reballing the nand risky? its pretty straight forward. with large balls far apart and no nearby underfilled chips. the only thing on the other side of the board is the sim tray.


On an iPhone logic board, underfilled parts are never really far away :>). Applying heat for anything always has risks. If you lift a pad or are not sure the chip was properly seated, then you have to rework the pad and apply heat a second time to double check.

Of course, you're skill level will have a direct correlation with success, still, it's a "best practices" point of view.


Thanks Luke!


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lukerockhill sera éternellement reconnaissant.
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