Modifications apportées à l'étape #10
Modifié par Walter Galan —
Modification approuvée par Walter Galan
- Avant
- Après
- Inchangé
Lignes de l'étape
| + | [* black] All ICs are located on the front side of the motherboard: |
|---|---|
| + | [* red] Elpida BA164B1PF |
| + | [* yellow] Samsung [link|http://www.samsung.com/global/business/semiconductor/file/media/Samsung_eMMC_Brochure-0.pdf|KLMBG4GE2A] 32 GB NAND Flash Memory |
| + | [* orange] Qualcomm [http://www.ubmtechinsights.com/reports-and-subscriptions/open-market-reports/Report-Profile/?ReportKey=8543|PM8921] Power Management |
| + | [* green] Qualcomm [http://www.qualcomm.com/chipsets/gobi|MDM9215M] 4G GSM/UMTS/LTE modem |
| + | [* blue] Synaptics S32028 |
| + | [* violet] TriQuint [link|http://www.triquint.com/products/p/TQM7M9023|TQM7M9023] Multi-Band Power Amplifier |
| + | [* black] Broadcom [link|http://www.broadcom.com/products/Wireless-LAN/802.11-Wireless-LAN-Solutions/BCM4335|BCM4335] Single-Chip 5G WiFi™ 802.11ac MAC/Baseband/Radio with Bluetooth 4.0+HS & FM Receiver |
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