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Modifications apportées à l'étape #3

Modifié par Adriana Zwink

Modification approuvée par Adriana Zwink

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Lignes de l'étape

[title] Wedge open the back cover
-[* black] Insert an opening tool between the back cover and the metal housing.
-[* black] Twist the opening tool to create a wider gap.
+[* black] Insert an opening tool into the seam between the back cover and the metal housing.
+[* black] Twist the opening tool to create a gap.
[* icon_caution] Don't try to remove the back cover all the way yet. The sensor flex cable is still connected to the motherboard.