Modifications apportées à l'étape #18
Modifié par Alex Diaz-Kokaisl —
Modification approuvée par Alex Diaz-Kokaisl
- Avant
- Après
- Inchangé
Lignes de l'étape
| [title] Reassembly information | |
| [* icon_reminder] Perform the following to clean the thermal paste: | |
| [* black] Use the flat end of a spudger to scrape off the thermal paste on the bottom of the logic board. | |
| - | [* black] Clean any remaining thermal paste residue with isopropyl alcohol and either a coffee filter or a lint-free cloth. |
| + | [* black] Clean any remaining thermal paste residue with isopropyl alcohol (>90%) and either a coffee filter or a lint-free cloth. |
| [* black] Repeat the cleaning process for the thermal paste on the frame. | |
| [* icon_reminder] During reassembly, follow [guide|157417|this guide|new_window=true] for reapplying thermal paste to your device. |